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Technology
Technologies from A to ZAmong Microdul’s strengths is the exceptional know-how in the areas of chip-on-chip, chip-on-board and chip-on-ceramic applications. Microdul masters the following process technologies and more:
- Die and wire bonding
- Globtop coating
- Flip chip
- SMD mounting
- Vacuum soldering
- Hand soldering
- Adhesive joining
- Heat sealing
- Laser trimming (active/passive)
- Module potting
- Functional testing
The right substrate for each application
We process all common substrates, such as FR4, FR5, Rigid-Flex, Flex, IMS, Rogers, as well as thin-film, thick-film and DCB ceramics. This enables reliable applications in the fields of analogue, digital, high-voltage and high-frequency technology. Our own thick-film manufacturing facilities as well as contacts with established substrate manufacturers over many years allow us to react flexibly to the most challenging wishes of our customers.
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