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Technology
| MD300 | MD400 | MD500 | |
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Availability |
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| Technology | 1µ SACMOS (C175SCe) | 1µ SACMOS (C175SCe) | 0.9µ SACMOS (C175SCs) |
| Process owner | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Fab | TSMC, Taiwan | TSMC, Taiwan | TSMC, Taiwan |
| Available since | 2000 | 2002 | 2004 |
| Chipsize | 1.20 x 1.44 mm, 1.73mm˛ | 0.90 x 1.20 mm, 1.08mm˛ | 2.00 x 2.18 mm, 4.36mm˛ |
| Max. chips per wafer | 8’800 | 14’400 | 3’400 |
| Customizable masks | 2 metal, 1 contact | 2 metal, 2 contact | 2 metal, 2 contact |
| Multiple chip units possible | yes | yes | yes |
| EPROM | 32 OTP cells | 32 OTP cells | 64 OTP cells |
| VDD core | 1 .. 5.5V | 1 .. 5.5V | 1 .. 5.5V |
| VDD periphery | Max. 9V | Max. 9V | Max. 9V |
| ESD protection | yes | yes | yes |
| Digital gates | 1168 (2-input equivalent) | 1104 (2-input equivalent) | 5536 (2-input equivalent) |
| Analogue transistors | 807 | 256 | 2304 |
| Linear capacitors | 192 | 150 | 524 |
| Resistors | 384 x 1k (PS) | 407k total (PS) | 2M7 total (PS) |
| 16 x 2k7(PS) 48 x 55k (N-well) 23 x 275k (N-well) |
6M5 total (N-well) | 20M5 total (N-well) | |
| I/O-pads | 16 (configurable) | 4 Input + 4 Output | 32 (configurable) |
| Handbook (pdf) | v1.0 (2001-08) | n.a. | v1.0 (2004-10) |
| Design rules (pdf) | v1.2 (2001-08) | n.a. | v1.0 (2004-10) |
| Layout library (pdf) | vC2 (2000-02) | n.a. | v1.0 (2004-11) |
| Array (gds2) | BAS300B4 (2005-03) | BAS400B4 (2006-01) |
BAS500B2 (2006-03) |
| Layout library (gds2) | LIB300C2 (2005-03) | LIB400B1 (2006-08) |
LIB500B2 (2006-03) |
| Letters for marking (gds2) | LET300A1 (2000-02) | LET400A2 (2002-08) |
LET500A1 (2004-12) |
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