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Technology
The strengths of thick-film technologyThick-film technology is a technology with first class reliability under extreme operating conditions. Since thick-film technology withstands humidity and high temperatures, it serves as a more efficient solution for protective circuits, pressure sensors and resistance networks than other substrate technologies. In addition, thick-film technology is suitable for combinations with diverse assembly and bonding techniques.
Processes from A to Z
In the manufacture of thick-film substrates, conductor tracks, resistance surfaces and insulating layers as well as feed-throughs are applied to the substrate by means of screen printing, and then fired at high temperatures. Precise resistances are achieved by using high- and low-resistive pastes as well as through trimming by laser. Microdul masters the following processes:
- Screen printing
- Multilayer printing
- Heating substrate printing
- Via printing (feed-through)
- Laser trimming
- Testing
Alternative substrate materials
Alongside the design of thick-film circuits, Microdul also works with alternative substrate technologies for special applications. In particular, we also master the printing and firing of steel and copper substrates.
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