Thick film substrate
4"x6" array; double side printed with through technology
Thick-film technology is characterized by first class reliability under extreme operating conditions. Since thick-film substrates withstand humidity and high temperatures, it serves as a more efficient solution for protective circuits, pressure sensors and resistance networks than other substrate technologies. In addition, thick-film technology is suitable for combinations with diverse assembly and bonding techniques.
In the manufacture of thick-film substrates, conductor tracks, resistance surfaces and insulating layers as well as feed-throughs are applied to the substrate by means of screen printing, and then fired at high temperatures. Precise resistances are achieved by using high- and low-resistive pastes as well as through trimming by laser. Microdul masters the following processes:
4"x6" array; double side printed with through technology
4"x4" array