Technology

Chip-on-Chip, Chip-on-Board, Flip-Chip, Chip-on-Ceramic

Microdul specializes in advanced packaging. Our strengths include exceptional expertise in the areas of chip-on-chip, chip-on-board, flip chip, and chip-on-ceramic. Microdul masters the following process technologies, among others:

Die Bonding
Wire Bonding
Glob Top Coating
Flip-Chip
SMD Mounting (Smallest components 008004)
Vacuum Soldering
Hand Soldering
Adhesive Joining
Heat Sealing
Laser Trimming (active/passive)
Module Potting
Functional Testing

The Right Substrate for each Application

We process all common substrates, such as FR4, FR5, Rigid-Flex, Flex, IMS, Rogers, as well as thin-film, thick-film and DCB ceramics. This enables reliable applications in the fields of analogue, digital, high-voltage and high-frequency technology. Our own thick-film manufacturing facilities as well as contacts with established substrate manufacturers over many years allow us to react flexibly to the most challenging wishes of our customers.

Fully automated Au wire bonder

Process: ball/wedge with 25um Au wire on a ceramic thick film substrate
Fully automated Al wire bonder

Process: wedge/wedge with 25um Al wire in ceramic package
Fully automated die bonder

Process: chip-on-chip (COC)
Fully automated flip-chip assembly with integrated dip station (flux)
Hand soldering of wire strands (under binocular loupe)
Fully automated die bonder

Assembly on rigid PCB
Fully automated Al wire bonder

Process: wedge/wedge with 25um Al wire
Fully automated Au wire bonder

Process: ball/wedge with 25um Au wire