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Technology

Among Microdul’s strengths is the exceptional know-how in the areas of chip-on-chip, chip-on-board and chip-on-ceramic applications. Microdul masters the following process technologies and more: 

  • Die and wire bonding
  • Globtop coating
  • Flip chip
  • SMD mounting
  • Vacuum soldering
  • Hand soldering
  • Adhesive joining
  • Heat sealing
  • Laser trimming (active/passive)
  • Module potting
  • Functional testing


The right substrate for each application
We process all common substrates, such as FR4, FR5, Rigid-Flex, Flex, IMS, Rogers, as well as thin-film, thick-film and DCB ceramics. This enables reliable applications in the fields of analogue, digital, high-voltage and high-frequency technology. Our own thick-film manufacturing facilities as well as contacts with established substrate manufacturers over many years allow us to react flexibly to the most challenging wishes of our customers.